参数名
参数值
参数名
参数值
表面安装
YES
终端数量
16
ECCN (US)
EAR99
Logic Family
HC
Number of Elements per Chip
1
Number of Inputs per Chip
8
Number of Input Enables per Element
0
Number of Selection Inputs per Element
3
Number of Outputs per Chip
1
Number of Output Enables per Element
1
Maximum Propagation Delay Time @ Maximum CL (ns)
33@6V|[email protected]|195@2V
Absolute Propagation Delay Time (ns)
275
Process Technology
CMOS
Input Signal Type
Single-Ended
Parity Invert Input
无
Output Signal Type
Differential
Maximum Low Level Output Current (mA)
5.2
Maximum High Level Output Current (mA)
-5.2
Minimum Operating Supply Voltage (V)
2
Typical Operating Supply Voltage (V)
3.3|5|2.5
Maximum Operating Supply Voltage (V)
6
Maximum Quiescent Current (uA)
4
Propagation Delay Test Condition (pF)
50
Maximum Power Dissipation (mW)
500
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Standard Package Name
SOP
Supplier Package
SOP
Mounting
表面贴装
Package Height
2(Max)
Package Length
10.06
Package Width
5.5
PCB changed
16
Lead Shape
Gull-wing
Package Description
FP-16DA
Package Style
小概要
Moisture Sensitivity Levels
1
Package Body Material
PLASTIC/EPOXY
Operating Temperature-Min
-40 °C
Reflow Temperature-Max (s)
20
Operating Temperature-Max
85 °C
Rohs Code
有
Manufacturer Part Number
HD74HC251FP-E
Supply Voltage-Nom (Vsup)
4.5 V
Package Code
SOP
Package Shape
RECTANGULAR
Manufacturer
Renesas Electronics Corporation
Part Life Cycle Code
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
Risk Rank
5.17
Part Package Code
SOIC
无铅代码
有
零件状态
Obsolete
ECCN 代码
EAR99
HTS代码
8542.31.00.01
技术
CMOS
端子位置
DUAL
终端形式
鸥翼
峰值回流焊温度(摄氏度)
260
功能数量
1
端子间距
1.27 mm
Reach合规守则
unknown
引脚数量
16
JESD-30代码
R-PDSO-G16
输出的数量
1
资历状况
不合格
输出类型
3-State
极性
Inverting/Non-Inverting
电源电压-最大值(Vsup)
6 V
温度等级
INDUSTRIAL
电源电压-最小值(Vsup)
2 V
配置
1 x 8:1
家人
HC/UH
逻辑功能
Multiplexer
输入数量
8
输出特性
3-STATE
座位高度-最大
2.2 mm
输出极性
COMPLEMENTARY
逻辑IC类型
MULTIPLEXER
传播延迟(tpd)
245 ns
电源类型
Single
宽度
5.5 mm
长度
10.06 mm
RoHS状态
RoHS non-compliant