参数名
参数值
参数名
参数值
表面安装
YES
终端数量
20
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Standard Package Name
SOP
Supplier Package
TSSOP
Mounting
表面贴装
Package Height
1(Max)
Package Length
6.8(Max)
Package Width
4.4
PCB changed
20
Lead Shape
Gull-wing
ECCN (US)
EAR99
Logic Family
LVC
Number of Channels per Chip
8
Number of Elements per Chip
1
Number of Element Inputs
8
Number of Element Outputs
8
Number of Output Enables per Element
1
Bus Hold
无
Triggering Type
Positive-Edge
Maximum Propagation Delay Time @ Maximum CL (ns)
[email protected]|[email protected]|7@5V
Absolute Propagation Delay Time (ns)
9.5
Process Technology
CMOS
Input Signal Type
Single-Ended
Maximum Low Level Output Current (mA)
24
Maximum High Level Output Current (mA)
-24
Minimum Operating Supply Voltage (V)
2
Typical Operating Supply Voltage (V)
5|2.5|3.3
Maximum Operating Supply Voltage (V)
5.5
Maximum Quiescent Current (mA)
0.01
Propagation Delay Test Condition (pF)
50
Package Description
TSSOP,
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Moisture Sensitivity Levels
1
Package Body Material
PLASTIC/EPOXY
Operating Temperature-Min
-40 °C
Reflow Temperature-Max (s)
20
Operating Temperature-Max
85 °C
Rohs Code
有
Manufacturer Part Number
HD74LVC574ATELL-E
Supply Voltage-Nom (Vsup)
2.7 V
Package Code
TSSOP
Package Shape
RECTANGULAR
Manufacturer
Renesas Electronics Corporation
Part Life Cycle Code
Obsolete
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
Risk Rank
7.83
Part Package Code
TSSOP
JESD-609代码
e4
无铅代码
有
零件状态
NRND
端子表面处理
镍钯金
HTS代码
8542.39.00.01
技术
CMOS
端子位置
DUAL
终端形式
鸥翼
峰值回流焊温度(摄氏度)
260
功能数量
1
端子间距
0.65 mm
Reach合规守则
unknown
引脚数量
20
JESD-30代码
R-PDSO-G20
资历状况
不合格
输出类型
3-State
极性
Non-Inverting
电源电压-最大值(Vsup)
5.5 V
温度等级
INDUSTRIAL
电源电压-最小值(Vsup)
2 V
端口的数量
2
比特数
8
家人
LVC/LCX/Z
逻辑功能
D-Type Bus Interface
输出特性
3-STATE
座位高度-最大
1.1 mm
输出极性
TRUE
逻辑IC类型
总线驱动器
传播延迟(tpd)
9.5 ns
宽度
4.4 mm
长度
6.5 mm
RoHS状态
RoHS non-compliant