参数名
参数值
参数名
参数值
表面安装
YES
终端数量
20
ECCN (US)
EAR99
Logic Family
LVC
Number of Channels per Chip
8
Number of Elements per Chip
1
Number of Element Inputs
8
Number of Element Outputs
8
Number of Output Enables per Element
1
Bus Hold
无
Triggering Type
Positive-Edge
Maximum Propagation Delay Time @ Maximum CL (ns)
[email protected]|[email protected]|7@5V
Absolute Propagation Delay Time (ns)
9.5
Process Technology
CMOS
Input Signal Type
Single-Ended
Maximum Low Level Output Current (mA)
24
Maximum High Level Output Current (mA)
-24
Minimum Operating Supply Voltage (V)
2
Typical Operating Supply Voltage (V)
5|2.5|3.3
Maximum Operating Supply Voltage (V)
5.5
Maximum Quiescent Current (mA)
0.01
Propagation Delay Test Condition (pF)
50
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Standard Package Name
SOP
Supplier Package
TSSOP
Mounting
表面贴装
Package Height
1(Max)
Package Length
6.8(Max)
Package Width
4.4
PCB changed
20
Lead Shape
Gull-wing
Package Description
TSSOP,
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Moisture Sensitivity Levels
1
Package Body Material
PLASTIC/EPOXY
Operating Temperature-Min
-40 °C
Reflow Temperature-Max (s)
20
Operating Temperature-Max
85 °C
Rohs Code
有
Manufacturer Part Number
HD74LVC574ATELL-E
Supply Voltage-Nom (Vsup)
2.7 V
Package Code
TSSOP
Package Shape
RECTANGULAR
Manufacturer
Renesas Electronics Corporation
Part Life Cycle Code
Obsolete
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
Risk Rank
7.83
Part Package Code
TSSOP
JESD-609代码
e4
无铅代码
有
零件状态
NRND
端子表面处理
镍钯金
HTS代码
8542.39.00.01
技术
CMOS
端子位置
DUAL
终端形式
鸥翼
峰值回流焊温度(摄氏度)
260
功能数量
1
端子间距
0.65 mm
Reach合规守则
unknown
引脚数量
20
JESD-30代码
R-PDSO-G20
资历状况
不合格
输出类型
3-State
极性
Non-Inverting
温度等级
INDUSTRIAL
端口的数量
2
比特数
8
家人
LVC/LCX/Z
逻辑功能
D-Type Bus Interface
输出特性
3-STATE
座位高度-最大
1.1 mm
输出极性
TRUE
逻辑IC类型
总线驱动器
传播延迟(tpd)
9.5 ns
电压 - 供电 (最大值)
5.5 V
电压 - 供电 (最小值)
2 V
宽度
4.4 mm
长度
6.5 mm
RoHS状态
RoHS non-compliant