Renesas Electronics America HD74HC157FP-E
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HD74HC157FP-E
2038-HD74HC157FP-E
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HD74HC157FP-E datasheet pdf and Integrated Circuits (ICs) product details from Renesas Electronics America stock available at utmel
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HD74HC157FP-E详情
Renesas Electronics America HD74HC157FP-E重要参数规格及、参数值,及相似型号如下:
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- 参数名参数值全选
表面安装
YES
终端数量
16
Manufacturer Part Number
HD74HC157FP-E
Rohs Code
有
Part Life Cycle Code
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
Part Package Code
SOIC
Package Description
FP-16DA
Risk Rank
7.69
Moisture Sensitivity Levels
1
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
SOP
Package Shape
RECTANGULAR
Package Style
小概要
Supply Voltage-Nom (Vsup)
4.5 V
Reflow Temperature-Max (s)
20
无铅代码
有
ECCN 代码
EAR99
HTS代码
8542.31.00.01
端子位置
DUAL
终端形式
鸥翼
峰值回流焊温度(摄氏度)
260
功能数量
4
端子间距
1.27 mm
Reach合规守则
unknown
引脚数量
16
JESD-30代码
R-PDSO-G16
输出的数量
1
资历状况
不合格
电源电压-最大值(Vsup)
6 V
温度等级
INDUSTRIAL
电源电压-最小值(Vsup)
2 V
家人
HC/UH
输入数量
2
座位高度-最大
2.2 mm
输出极性
TRUE
逻辑IC类型
MULTIPLEXER
传播延迟(tpd)
155 ns
长度
10.06 mm
宽度
5.5 mm
HD74HC157FP-E拓展信息
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America







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