Renesas Electronics America HM1-6551/883

表面安装

NO

终端数量

22

Manufacturer Part Number

HM1-6551/883

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Part Package Code

DIP

Package Description

CERAMIC, DIP-22

Risk Rank

5.79

Access Time-Max

300 ns

Number of Words

256 words

Number of Words Code

256

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC, GLASS-SEALED

Package Code

DIP

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

5 V

Usage Level

Military grade

端子表面处理

未说明

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

引脚数量

22

JESD-30代码

R-GDIP-T22

资历状况

MILITARY

电源电压-最大值(Vsup)

5.5 V

温度等级

MILITARY

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

组织结构

256X4

座位高度-最大

5.72 mm

内存宽度

4

记忆密度

1024 bit

筛选水平

MIL-STD-883 Class B

并行/串行

PARALLEL

内存IC类型

标准SRAM

宽度

10.16 mm