Renesas Electronics America M66503ASP
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M66503ASP
2038-M66503ASP
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M66503ASP datasheet pdf and Integrated Circuits (ICs) product details from Renesas Electronics America stock available at utmel
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M66503ASP详情
Renesas Electronics America M66503ASP重要参数规格及、参数值,及相似型号如下:
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表面安装
NO
终端数量
30
Manufacturer Part Number
M66503ASP
Rohs Code
无
Part Life Cycle Code
Obsolete
Ihs Manufacturer
MITSUBISHI ELECTRIC CORP
Part Package Code
DIP
Package Description
SDIP, SDIP30,.4
Risk Rank
5.84
Operating Temperature-Max
85 °C
Operating Temperature-Min
-20 °C
Package Body Material
PLASTIC/EPOXY
Package Code
SDIP
Package Equivalence Code
SDIP30,.4
Package Shape
RECTANGULAR
Package Style
IN-LINE, SHRINK PITCH
Supply Voltage-Max
5.5 V
Supply Voltage-Nom
5 V
Reflow Temperature-Max (s)
未说明
Supply Voltage-Min
4.5 V
JESD-609代码
e0
ECCN 代码
EAR99
端子表面处理
Tin/Lead (Sn/Pb)
附加功能
COMMON-ANODE
HTS代码
8542.39.00.01
端子位置
DUAL
终端形式
THROUGH-HOLE
峰值回流焊温度(摄氏度)
未说明
功能数量
1
端子间距
1.778 mm
Reach合规守则
unknown
引脚数量
30
JESD-30代码
R-PDIP-T30
资历状况
不合格
电源
5 V
温度等级
OTHER
座位高度-最大
5.08 mm
接口IC类型
LED显示驱动
fmax-Min
5 MHz
分段数
16
多路显示功能
NO
显示模式
SEGMENT
数据输入模式
SERIAL
长度
28 mm
宽度
10.16 mm
M66503ASP拓展信息
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America







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