Rochester Electronics AMPAL18P8AL/B2A

表面安装

YES

终端数量

20

Package

Bulk

Base Product Number

MC37X75

厂商

Panduit Corp

Product Status

Obsolete

Package Description

QCCN,

Package Style

CHIP CARRIER

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Operating Temperature-Min

-55 °C

Supply Voltage-Nom

5 V

Supply Voltage-Min

4.5 V

Operating Temperature-Max

125 °C

Manufacturer Part Number

AMPAL18P8AL/B2A

Package Code

QCCN

Package Shape

SQUARE

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Number of I/O Lines

8

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Supply Voltage-Max

5.5 V

Risk Rank

5.67

系列

*

JESD-609代码

e0

ECCN 代码

3A001.A.2.C

端子表面处理

锡铅

HTS代码

8542.39.00.01

技术

TTL

端子位置

QUAD

终端形式

无铅

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-CQCC-N20

温度等级

MILITARY

传播延迟

30 ns

组织结构

10 DEDICATED INPUTS, 8 I/O

座位高度-最大

2.54 mm

可编程逻辑类型

OT PLD

输出功能

COMBINATORIAL

专用输入数量

10

宽度

8.89 mm

长度

8.89 mm