Rochester Electronics CD4007MJ/883B

表面安装

NO

终端数量

14

RoHS

有

Package Description

DIP, DIP14,.3

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP14,.3

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

CD4007MJ/883B

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

National Semiconductor Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Risk Rank

5.92

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Gates

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T14

资历状况

不合格

电源

3/15 V

温度等级

MILITARY

筛选水平

38535Q/M;38534H;883B