Rochester Electronics DS8887J

表面安装

NO

终端数量

18

Manufacturer Part Number

DS8887J

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Package Description

DIP, DIP18,.3

Risk Rank

5.92

Operating Temperature-Max

70 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP18,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T18

资历状况

不合格

温度等级

COMMERCIAL