ROHM Semiconductor ML7037-003
- 收藏
- 对比
ML7037-003
2078-ML7037-003
集成电路(IC)
--
大陆
立即发货

ML7037-003 datasheet pdf and Integrated Circuits (ICs) product details from ROHM Semiconductor stock available at utmel
1最小包装量--
ML7037-003详情
ROHM Semiconductor ML7037-003重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
表面安装
YES
终端数量
64
Manufacturer Part Number
ML7037-003
Part Life Cycle Code
接触制造商
Ihs Manufacturer
LAPIS SEMICONDUCTOR CO LTD
Package Description
TFQFP,
Risk Rank
5.65
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
TFQFP
Package Shape
SQUARE
Package Style
FLATPACK, THIN PROFILE, FINE PITCH
Supply Voltage-Nom
3.3 V
HTS代码
8542.39.00.01
端子位置
QUAD
终端形式
鸥翼
功能数量
1
端子间距
0.5 mm
Reach合规守则
unknown
JESD-30代码
S-PQFP-G64
温度等级
INDUSTRIAL
座位高度-最大
1.2 mm
通信IC类型
电信电路
长度
10 mm
宽度
10 mm
ML7037-003拓展信息
ROHM Semiconductor
ROHM Semiconductor
ROHM Semiconductor
Rohm
Rohm
ROHM Semiconductor
ROHM Semiconductor
ROHM Semiconductor
ROHM Semiconductor
ROHM Semiconductor







哦! 它是空的。