ROHM Semiconductor ML7037-003TBZ03A

表面安装

YES

终端数量

64

Package Description

TFQFP,

Package Style

FLATPACK, THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

ML7037-003TBZ03A

Package Code

TFQFP

Package Shape

SQUARE

Manufacturer

LAPIS Semiconductor Co Ltd

Part Life Cycle Code

活跃

Ihs Manufacturer

LAPIS SEMICONDUCTOR CO LTD

Risk Rank

5.65

HTS代码

8542.39.00.01

端子位置

QUAD

终端形式

鸥翼

功能数量

1

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

S-PQFP-G64

温度等级

INDUSTRIAL

座位高度-最大

1.2 mm

通信IC类型

电信电路

宽度

10 mm

长度

10 mm