Samsung KLM8G2FE3B-B0010

表面安装

YES

终端数量

153

Package Description

VFBGA,

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-25 °C

Supply Voltage-Nom

1.8 V

Supply Voltage-Min

1.7 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

KLM8G2FE3B-B0010

Package Code

VFBGA

Package Shape

RECTANGULAR

Manufacturer

三星半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Supply Voltage-Max

1.95 V

Risk Rank

5.83

附加功能

ALSO OPERATES AT 2.7 V MIN

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B153

温度等级

OTHER

uPs/uCs/外围ICs类型

SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

座位高度-最大

1 mm

外部数据总线宽度

8

主机数据传输速率-最大

44 MBps

主机接口标准

USB

宽度

11.5 mm

长度

13 mm