Samsung Electronics M393A2K43BB1-CTD

ECCN (US)

4A994.a

HTS

8473.30.11.40

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

18

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2666

Chip Configuration

1Gx8

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Commercial

ECC Support

无

Number of Ranks

Dual

CAS Latency

19

Standard Package Name

DIM

Supplier Package

RDIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

Package Width

3.9(Max)

PCB changed

288

Lead Shape

No Lead

零件状态

活跃

引脚数量

288

组织结构

2Gx72

模块类型

288RDIMM

RoHS状态

符合RoHS标准