Samsung Electronics M393B2K70CM0-CF8

ECCN (US)

4A994.a

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

36

Chip Density (bit)

4G(DDP)

Data Bus Width (bit)

72

Max. Access Time (ns)

0.3

Maximum Clock Rate (MHz)

1066

Chip Configuration

1Gx4

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Operating Current (mA)

4734

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Module Sides

Double

ECC Support

有

Number of Ranks

Quad

Number of Chip Banks

8

CAS Latency

7

SPD EEPROM Support

有

Standard Package Name

DIMM

Supplier Package

RDIMM

Mounting

Socket

Package Height

30

Package Length

133.35

Package Width

4(Max)

PCB changed

240

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

240

组织结构

2Gx72

锁相环

无

自我刷新

有

模块类型

240RDIMM

RoHS状态

符合RoHS标准