Samsung Semiconductor KA358D

表面安装

YES

Contact plating

gold-plated

Number of pins

26

终端数量

8

Part Life Cycle Code

Transferred

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Part Package Code

SOIC

Package Description

0.225 INCH, SOP-8

Common-mode Reject Ratio-Nom

80 dB

Neg Supply Voltage Limit-Max

-16 V

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SOP

Package Equivalence Code

SOP8,.25

Package Shape

RECTANGULAR

Package Style

小概要

Supply Voltage-Nom (Vsup)

5 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2mm

Electrical mounting

SMT

Connector pinout layout

2x13

Row pitch

2mm

Gross weight

1.28 g

Operating temperature

-40...163°C

ECCN 代码

EAR99

HTS代码

8542.33.00.01

端子位置

DUAL

终端形式

鸥翼

功能数量

2

端子间距

1.27 mm

Reach合规守则

compliant

Current rating

2.5A

引脚数量

8

JESD-30代码

R-PDSO-G8

资历状况

不合格

温度等级

COMMERCIAL

电源电流-最大值

2 mA

建筑学

VOLTAGE-FEEDBACK

放大器类型

OPERATIONAL AMPLIFIER

座位高度-最大

1.95 mm

平均偏置电流-最大值 (IIB)

0.5 μA

低偏移

NO

频率补偿

YES

电源电压限制-最大值

16 V

最大偏置电流 (IIB) @25C

0.25 μA

输入失调电压-最大值

9000 μV

Rated voltage

100V

电压增益 - 最小值

15000

个人资料

beryllium copper

长度

4.9 mm

宽度

3.9 mm

Plating thickness

0.254µm

Flammability rating

UL94V-0