Samsung Semiconductor KAE00C400M-TGNN

表面安装

YES

终端数量

111

Manufacturer Part Number

KAE00C400M-TGNN

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

FBGA, BGA111,12X13,32

Risk Rank

5.84

Access Time-Max

80 ns

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA111,12X13,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, FINE PITCH

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B111

资历状况

不合格

电源

2.5,3.3 V

温度等级

OTHER

待机电流-最大值

0.00005 A

内存IC类型

存储器电路

混合内存类型

FLASH+PSRAM