Samsung Semiconductor KSB834-Y

表面安装

NO

终端数量

3

晶体管元件材料

SILICON

外壳材料

1

Type of module

thyristor

Semiconductor structure

common cathode,

Max. off-state voltage

1.8kV

Version

A72

Case

SEMIPACK1

Max. forward voltage

1.65V

Max. forward impulse current

2kA

Gate current

150mA

Electrical mounting

FASTON connectors,

Mechanical mounting

screw

Gross weight

120 g

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Part Package Code

SFM

Package Description

TO-220, 3 PIN

Operating Temperature-Max

150 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

FLANGE MOUNT

Transition Frequency-Nom (fT)

9 MHz

ECCN 代码

EAR99

HTS代码

8541.29.00.95

端子位置

SINGLE

终端形式

THROUGH-HOLE

Reach合规守则

unknown

引脚数量

3

JESD-30代码

R-PSFM-T3

资历状况

不合格

配置

SINGLE

晶体管应用

AMPLIFIER

极性/通道类型

PNP

JEDEC-95代码

TO-220AB

Load current

95A

集电极电流-最大值(IC)

3 A

最小直流增益（hFE）

100

集电极-发射器电压-最大值

60 V

VCEsat-最大值

1 V

环境耗散-最大值

30 W