Samtec, Inc. 10552/BEAJC

表面安装

NO

终端数量

16

Manufacturer Part Number

10552/BEAJC

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

DIP, DIP16,.3

Risk Rank

5.92

Number of Words

256 words

Number of Words Code

256

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

资历状况

不合格

温度等级

MILITARY

操作模式

ASYNCHRONOUS

组织结构

256X1

内存宽度

1

筛选水平

38535Q/M;38534H;883B

并行/串行

PARALLEL

内存IC类型

标准SRAM