Sanken 2SA764

终端数量

2

晶体管元件材料

SILICON

Package Style

FLANGE MOUNT

Package Shape

ROUND

Package Body Material

METAL

Number of Elements

1

Risk Rank

5.77

Package Description

FLANGE MOUNT, O-MBFM-P2

Ihs Manufacturer

NEW JERSEY SEMICONDUCTOR PRODUCTS INC

Part Life Cycle Code

活跃

Manufacturer Part Number

2SA764

端子位置

BOTTOM

终端形式

PIN/PEG

Reach合规守则

unknown

JESD-30代码

O-MBFM-P2

配置

SINGLE

极性/通道类型

PNP

集电极电流-最大值(IC)

0.5 A

集电极-发射器电压-最大值

100 V