Sanyo Denki LB1663M

表面安装

YES

终端数量

24

Manufacturer Part Number

LB1663M

Part Life Cycle Code

活跃

Ihs Manufacturer

ON SEMICONDUCTOR

Risk Rank

5.73

Operating Temperature-Max

80 °C

Operating Temperature-Min

-30 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SSOP

Package Equivalence Code

SOP24,.3,40

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, SHRINK PITCH

端子位置

DUAL

终端形式

鸥翼

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

R-PDSO-G24

资历状况

不合格

温度等级

商业扩展

供应电流-最大值(Isup)

50 mA