Semelab BUZ900P

表面安装

NO

终端数量

3

晶体管元件材料

SILICON

Package Description

FLANGE MOUNT, R-PSFM-T3

Package Style

FLANGE MOUNT

Package Body Material

PLASTIC/EPOXY

Manufacturer Part Number

BUZ900P

Package Shape

RECTANGULAR

Manufacturer

TT Electronics Power and Hybrid / Semelab Limited

Number of Elements

1

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SEMELAB LTD

Risk Rank

5.79

Drain Current-Max (ID)

8 A

ECCN 代码

EAR99

端子位置

SINGLE

终端形式

THROUGH-HOLE

Reach合规守则

compliant

JESD-30代码

R-PSFM-T3

资历状况

不合格

配置

SINGLE

操作模式

增强型MOSFET

箱体转运

ISOLATED

晶体管应用

AMPLIFIER

极性/通道类型

N-CHANNEL

JEDEC-95代码

TO-247

DS 击穿电压-最小值

160 V

场效应管技术

METAL-OXIDE SEMICONDUCTOR