Siemens 3VL37202MH330AA0

包装/外壳

1812

终端数量

2

Product Depth (mm)

3.2(mm)

Wire Form

不需要

Operating Temp Range

-55C to 125C

Case Style

陶瓷芯片

Product Diameter (mm)

Not Required(mm)

Mounting Styles

表面贴装

Temp Coeff (Dielectric)

BX

Lead Diameter (nom)

Not Required(mm)

Tolerance (+ or -)

10%

Rad Hardened

无

Microwave Application

YES

Seated Plane Height

Not Required(mm)

包装

卷带

电容量

180000(pF)

技术

STANDARD

结构

SMT 芯片

终端样式

PAD

失败率

P

电压

50VDC

产品长度(mm)

4.5(mm)

产品高度(mm)

1.5(mm)