SK HYNIX INC HY5Y5A6DLF-PF

表面安装

YES

终端数量

54

Manufacturer Part Number

HY5Y5A6DLF-PF

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SK HYNIX INC

Package Description

FBGA, BGA54,9X9,32

Risk Rank

5.84

Access Time-Max

7 ns

Clock Frequency-Max (fCLK)

105 MHz

Number of Words

16777216 words

Number of Words Code

16000000

Operating Temperature-Max

70 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA54,9X9,32

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B54

资历状况

不合格

电源

3/3.3 V

温度等级

OTHER

电源电流-最大值

0.165 mA

组织结构

16MX16

输出特性

3-STATE

内存宽度

16

待机电流-最大值

0.00035 A

记忆密度

268435456 bit

I/O类型

COMMON

内存IC类型

同步剧

刷新周期

8192

顺序突发长度

1,2,4,8,FP

交错突发长度

1,2,4,8