SMSC COM20010ILJP

表面安装

YES

终端数量

28

Inflammability class of insulation material according to with UL94

V0

Package Description

QCCJ, LDCC28,.5SQ

Package Style

CHIP CARRIER

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

LDCC28,.5SQ

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

5 V

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

COM20010ILJP

Package Code

QCCJ

Package Shape

SQUARE

Manufacturer

SMSC

Part Life Cycle Code

Obsolete

Ihs Manufacturer

STANDARD MICROSYSTEMS CORP

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Serial IO/Communication Controllers

技术

CMOS

端子位置

QUAD

终端形式

J BEND

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-PQCC-J28

资历状况

不合格

电源

5 V

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

SERIAL IO/COMMUNICATION CONTROLLER, LAN

电源电流-最大值

50 mA