参数名
参数值
参数名
参数值
工厂交货时间
30 Weeks
表面安装
YES
终端数量
20
ECCN (US)
EAR99
HTS
8542.39.00.01
Logic Family
AC
Number of Elements per Chip
1
Number of Channels per Chip
8
Standard Package Name
FPAK
Supplier Package
CFPAK
Mounting
表面贴装
Package Height
2.21(Max)
Package Length
13.08(Max)
Package Width
7.24(Max)
PCB changed
20
Lead Shape
Flat
Supplier Temperature Grade
Military
Maximum Operating Temperature (°C)
125
Minimum Operating Temperature (°C)
-55
Maximum Power Dissipation (mW)
500
Propagation Delay Test Condition (pF)
50
Maximum Quiescent Current (uA)
80
Maximum Operating Supply Voltage (V)
6
Typical Operating Supply Voltage (V)
5|2.5|3.3
Minimum Operating Supply Voltage (V)
2
Maximum High Level Output Current (mA)
-50
Maximum Low Level Output Current (mA)
50
Input Signal Type
Single-Ended
Process Technology
CMOS
Absolute Propagation Delay Time (ns)
15
Maximum Propagation Delay Time @ Maximum CL (ns)
[email protected]|10@3V
Bus Hold
无
Number of Output Enables per Chip
2 Low
Number of Outputs per Chip
8
Number of Input Enables per Chip
0
Number of Inputs per Chip
8
Package Style
FLATPACK
Load Capacitance (CL)
50 pF
Package Body Material
CERAMIC
Package Equivalence Code
FL20,.3
Operating Temperature-Min
-55 °C
Operating Temperature-Max
125 °C
Rohs Code
有
Manufacturer Part Number
5962F8870601VXA
Package Code
DFP
Package Shape
RECTANGULAR
Manufacturer
STMicroelectronics
Part Life Cycle Code
活跃
Ihs Manufacturer
STMICROELECTRONICS
Risk Rank
5.47
Prop.
10 ns
Usage Level
Military grade
包装
Strip
JESD-609代码
e0
零件状态
活跃
端子表面处理
Tin/Lead (Sn/Pb)
HTS代码
8542.39.00.01
子类别
Bus Driver/Transceiver
技术
CMOS
端子位置
DUAL
终端形式
FLAT
功能数量
1
端子间距
1.27 mm
Reach合规守则
compliant
引脚数量
20
JESD-30代码
R-XDFP-F20
资历状况
Qualified
输出类型
3-State
极性
Non-Inverting
电源
3.3/5 V
温度等级
MILITARY
比特数
8
逻辑功能
Buffer/Line Driver
输出特性
3-STATE
输出极性
TRUE
逻辑IC类型
总线驱动器
最大 I(ol)
0.012 A
筛选水平
38535V;38534K;883S
控制类型
低电平
总剂量
300k Rad(Si) V