STMicroelectronics GNS7560ET2UM

表面安装

YES

终端数量

54

Manufacturer Part Number

GNS7560ET2UM

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ST-ERICSSON

Package Description

TFBGA,

Risk Rank

5.84

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Supply Voltage-Nom

1.2 V

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.65 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B54

温度等级

INDUSTRIAL

座位高度-最大

1.1 mm

通信IC类型

射频和基带电路

长度

6 mm

宽度

4 mm