STMicroelectronics HCC4013BF

表面安装

NO

终端数量

14

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP14,.3

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

HCC4013BF

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

SGS-Ates Componenti Electronici SPA

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SGS-ATES COMPONENTI ELECTRONICI S P A

Risk Rank

5.9

Prop.

400 ns

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

FF/Latches

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

2

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T14

资历状况

不合格

电源

5/15 V

温度等级

MILITARY

逻辑IC类型

D FLIP-FLOP

触发器类型

积极优势