STMicroelectronics HCC4050BK

表面安装

YES

引脚数

16

终端数量

16

RoHS

Non-Compliant

Package Description

DFP, FL16,.3

Package Style

FLATPACK

Package Body Material

CERAMIC

Package Equivalence Code

FL16,.3

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

HCC4050BK

Package Code

DFP

Package Shape

RECTANGULAR

Manufacturer

SGS-Ates Componenti Electronici SPA

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SGS-ATES COMPONENTI ELECTRONICI S P A

Risk Rank

5.91

包装

Bulk

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Gates

技术

CMOS

端子位置

DUAL

终端形式

FLAT

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-XDFP-F16

资历状况

不合格

极性

Non-Inverting

电源

5/15 V

温度等级

MILITARY

静态电流

40 nA

逻辑功能

Buffer

逻辑IC类型

BUFFER

施密特触发器

NO

辐射硬化

无