STMicroelectronics HSP031-1BM6

安装类型

表面贴装

包装/外壳

QFN-6

厂商

STMicroelectronics

Product Status

活跃

Base Product Number

HSP031

Number of Elements per Chip

1

Package Type

QFN - 6L

Peak Pulse Power Dissipation

300kW

Direction Type

Bi-Directional

Cd - Diode Capacitance

0.9 pF

Breakdown Voltage / V

-

Pd - Power Dissipation

-

Maximum Operating Temperature

+ 150 C

Vesd - Voltage ESD Contact

30 kV

Unit Weight

0.000080 oz

Minimum Operating Temperature

- 55 C

Factory Pack QuantityFactory Pack Quantity

5000

Ipp - Peak Pulse Current

10 A

Pppm - Peak Pulse Power Dissipation

-

Manufacturer

STMicroelectronics

Brand

STMicroelectronics

RoHS

Details

Vesd - Voltage ESD Air Gap

30 kV

系列

-

包装

MouseReel

子类别

TVS Diodes / ESD Suppression Diodes

引脚数量

6

终端样式

SMD/SMT

工作电压

3.3 V

极性

单向

通道数量

2 Channel

箝位电压

7 V

产品类别

ESD抑制器

二极管配置

Array

Vf-正向电压

-

产品类别

ESD Suppressors / TVS Diodes