STMicroelectronics L2G3IS

表面安装

YES

终端数量

16

Package Description

VFLGA,

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Manufacturer Part Number

L2G3IS

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

VFLGA

Package Shape

RECTANGULAR

Manufacturer

STMicroelectronics

Part Life Cycle Code

Obsolete

Ihs Manufacturer

STMICROELECTRONICS

Risk Rank

5.83

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BUTT

功能数量

1

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B16

电源电压-最大值(Vsup)

3.6 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.42 V

模拟 IC - 其他类型

模拟电路

座位高度-最大

1 mm

宽度

3 mm

长度

3.5 mm