STMicroelectronics LS588N1

表面安装

NO

终端数量

16

Package Description

DIP, DIP16,.3

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP16,.3

Operating Temperature-Min

-45 °C

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

LS588N1

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

STMicroelectronics

Part Life Cycle Code

Obsolete

Ihs Manufacturer

STMICROELECTRONICS

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

其他电信集成电路

技术

BIPOLAR

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

not_compliant

JESD-30代码

R-PDIP-T16

资历状况

不合格

温度等级

OTHER

电源电流-最大值

150 mA