STMicroelectronics LS709CB

表面安装

NO

终端数量

14

RoHS

Non-Compliant

Package Description

DIP, DIP14,.3

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP14,.3

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

LS709CB

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

SGS-Ates Componenti Electronici SPA

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SGS-ATES COMPONENTI ELECTRONICI S P A

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

运算放大器

技术

BIPOLAR

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T14

资历状况

不合格

温度等级

COMMERCIAL

建筑学

VOLTAGE-FEEDBACK

放大器类型

OPERATIONAL AMPLIFIER

低偏移

NO

频率补偿

NO

输入失调电压-最大值

10000 µV