STMicroelectronics LSM9DS0

表面安装

YES

终端数量

24

Package Description

4 X 4 MM, 1 MM HEIGHT, GREEN, PLASTIC, LGA-24

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

30

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

LSM9DS0

Supply Voltage-Nom (Vsup)

3 V

Package Code

TFLGA

Package Shape

SQUARE

Manufacturer

STMicroelectronics

Part Life Cycle Code

Obsolete

Samacsys Description

IMUs - Inertial Measurement Units iNEMO inertial mod 3D Accl-Gyro-Mgntmtr

Ihs Manufacturer

STMICROELECTRONICS

Risk Rank

5.77

Part Package Code

LGA

JESD-609代码

e4

ECCN 代码

EAR99

端子表面处理

镍钯金

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BUTT

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

0.5 mm

Reach合规守则

unknown

引脚数量

24

JESD-30代码

S-PBGA-B24

Brand Name

STMicroelectronics

电源电压-最大值(Vsup)

3.6 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.4 V

模拟 IC - 其他类型

模拟电路

座位高度-最大

1.07 mm

宽度

4 mm

长度

4 mm