STMicroelectronics M25P16-VMN6

表面安装

YES

Housing material

PA66 UL94V-0

终端数量

8

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

STMICROELECTRONICS

Package Description

0.150 INCH, SOP-8

Clock Frequency-Max (fCLK)

50 MHz

Number of Words

2097152 words

Number of Words Code

2000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SOP

Package Shape

RECTANGULAR

Package Style

小概要

Number of terals

3min

Conductor diameter (cross section)

2.5 sq. mm (24-12 AWG)

Mounting method

on board, soldering

Dielectric strength

2000 V (50 Hz)/ 1 min.

JESD-609代码

e0

ECCN 代码

EAR99

类型

Screw modular terminal block, 45° angled, on board, 3 contacts, series RG103-5.0

端子表面处理

锡铅

颜色

green

HTS代码

8542.32.00.51

螺距

5.0 mm

端子位置

DUAL

终端形式

鸥翼

功能数量

1

深度

13.4 mm

Reach合规守则

compliant

JESD-30代码

R-PDSO-G8

电源电压-最大值(Vsup)

3.6 V

Contact resistance

≤20 mΩ

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.7 V

Insulation resistance

≥5000 MΩ (at Uinsp.dc=1000 V)

操作模式

SYNCHRONOUS

组织结构

2MX8

内存宽度

8

Operating temperature range

-40…+105 °C

Rated current

10 A

记忆密度

16777216 bit

并行/串行

SERIAL

Wire cross section

2.5 sq. mm

内存IC类型

FLASH

编程电压

2.7 V

Rated voltage

300 V

高度

15.5 mm

宽度

15.0 mm