STMicroelectronics M3561B

表面安装

NO

终端数量

18

Risk Rank

5.88

Ihs Manufacturer

STMICROELECTRONICS

Part Life Cycle Code

Obsolete

Manufacturer

STMicroelectronics

Package Shape

RECTANGULAR

Package Code

DIP

Manufacturer Part Number

M3561B

Rohs Code

无

Operating Temperature-Max

70 °C

Operating Temperature-Min

-25 °C

Package Equivalence Code

DIP18,.3

Package Body Material

PLASTIC/EPOXY

Package Style

IN-LINE

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

电话回路

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

not_compliant

JESD-30代码

R-PDIP-T18

资历状况

不合格

电源

1.5/5.5 V

温度等级

OTHER

电源电流-最大值

0.5 mA