STMicroelectronics M74HC08RM13
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M74HC08RM13
2381-M74HC08RM13
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M74HC08RM13 datasheet pdf and Integrated Circuits (ICs) product details from STMicroelectronics stock available at utmel
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M74HC08RM13详情
STMicroelectronics M74HC08RM13重要参数规格及、参数值,及相似型号如下:
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表面安装
YES
终端数量
14
Manufacturer Part Number
M74HC08RM13
Part Life Cycle Code
活跃
Ihs Manufacturer
STMICROELECTRONICS
Package Description
TSSOP,
Risk Rank
5.74
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
Package Code
TSSOP
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Supply Voltage-Nom (Vsup)
4.5 V
HTS代码
8542.39.00.01
端子位置
DUAL
终端形式
鸥翼
功能数量
4
端子间距
0.65 mm
Reach合规守则
compliant
JESD-30代码
R-PDSO-G14
电源电压-最大值(Vsup)
6 V
温度等级
MILITARY
电源电压-最小值(Vsup)
2 V
家人
HC/UH
输入数量
2
座位高度-最大
1.2 mm
逻辑IC类型
AND GATE
传播延迟(tpd)
110 ns
长度
5 mm
宽度
4.4 mm
M74HC08RM13拓展信息
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