STMicroelectronics M74HC138F1

表面安装

NO

终端数量

16

Risk Rank

5.9

Ihs Manufacturer

SGS-ATES COMPONENTI ELECTRONICI S P A

Part Life Cycle Code

Obsolete

Rohs Code

无

Manufacturer Part Number

M74HC138F1

Package Style

IN-LINE

Package Shape

RECTANGULAR

Package Equivalence Code

DIP16,.3

Package Code

DIP

Package Body Material

CERAMIC

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

资历状况

不合格

电源

2/6 V

温度等级

INDUSTRIAL

逻辑IC类型

OTHER DECODER/DRIVER