参数名
参数值
参数名
参数值
生命周期状态
Production (Last Updated: 2 years ago)
底架
表面贴装
引脚数
48
ECCN (US)
EAR99
HTS
8542.39.00.01
Logic Family
ACT
Number of Elements per Chip
4
Number of Channels per Chip
16
Number of Inputs per Chip
16
Number of Input Enables per Chip
0
Number of Outputs per Chip
16
Number of Output Enables per Chip
4 Low
Bus Hold
无
Maximum Propagation Delay Time @ Maximum CL (ns)
[email protected] to 5.5V
Absolute Propagation Delay Time (ns)
13
Process Technology
CMOS
Input Signal Type
Single-Ended
Maximum Low Level Output Current (mA)
24
Maximum High Level Output Current (mA)
-24
Minimum Operating Supply Voltage (V)
4.5
Typical Operating Supply Voltage (V)
5
Maximum Operating Supply Voltage (V)
5.5
Maximum Quiescent Current (uA)
160
Propagation Delay Test Condition (pF)
50
Maximum Power Dissipation (mW)
500
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
125
Supplier Temperature Grade
Military
Standard Package Name
FPAK
Supplier Package
CFPAK
Mounting
表面贴装
Package Height
2.47
Package Length
15.75
Package Width
9.65
PCB changed
48
Lead Shape
Flat
Number of Elements
4
RoHS
Compliant
包装
卷带
零件状态
活跃
最高工作温度
125 °C
最小工作温度
-55 °C
引脚数量
48
输出的数量
16
输出类型
3-State
工作电源电压
5 V
极性
Non-Inverting
通道数量
16
最大电源电压
5.5 V
最小电源电压
4.5 V
传播延迟
13 ns
静态电流
160 µA
逻辑功能
Buffer/Line Driver
输入数量
16
高电平输出电流
-24 mA
低水平输出电流
24 mA
RoHS状态
RoHS non-compliant
辐射硬化
有