STMicroelectronics TDA1054M

表面安装

NO

终端数量

16

Part Life Cycle Code

Obsolete

Ihs Manufacturer

STMICROELECTRONICS

Package Description

DIP, DIP16,.3

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

ECCN 代码

EAR99

HTS代码

8542.33.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

R-PDIP-T16

资历状况

不合格

消费者集成电路类型

音频前置放大器