STMicroelectronics WS57C128FB-35D

表面安装

NO

终端数量

28

Package Description

0.600 INCH, CERAMIC, DIP-28

Package Style

IN-LINE

Number of Words Code

16000

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Access Time-Max

35 ns

Operating Temperature-Max

70 °C

Manufacturer Part Number

WS57C128FB-35D

Number of Words

16384 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

e2v technologies

Part Life Cycle Code

活跃

Ihs Manufacturer

TELEDYNE E2V (UK) LTD

Risk Rank

5.61

Part Package Code

DIP

ECCN 代码

EAR99

HTS代码

8542.32.00.61

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

Reach合规守则

compliant

引脚数量

28

JESD-30代码

R-CDIP-T28

电源电压-最大值(Vsup)

5.5 V

温度等级

COMMERCIAL

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

组织结构

16KX8

内存宽度

8

记忆密度

131072 bit

并行/串行

PARALLEL

内存IC类型

UVPROM