STMicroelectronics WS57C128FB-70D

表面安装

NO

终端数量

28

Package

Bulk

Base Product Number

085491

厂商

Molex

Product Status

活跃

Package Description

0.600 INCH, CERAMIC, DIP-28

Package Style

IN-LINE

Number of Words Code

16000

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Access Time-Max

70 ns

Operating Temperature-Max

70 °C

Manufacturer Part Number

WS57C128FB-70D

Number of Words

16384 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

e2v technologies

Part Life Cycle Code

活跃

Ihs Manufacturer

TELEDYNE E2V (UK) LTD

Risk Rank

5.37

Part Package Code

DIP

系列

*

ECCN 代码

EAR99

HTS代码

8542.32.00.61

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

Reach合规守则

compliant

引脚数量

28

JESD-30代码

R-CDIP-T28

电源电压-最大值(Vsup)

5.5 V

温度等级

COMMERCIAL

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

组织结构

16KX8

内存宽度

8

记忆密度

131072 bit

并行/串行

PARALLEL

内存IC类型

UVPROM