STMicroelectronics WS57C256F-55DI

表面安装

NO

终端数量

28

Manufacturer Part Number

WS57C256F-55DI

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

WAFERSCALE INTEGRATION INC

Risk Rank

5.72

Access Time-Max

55 ns

Number of Words

32768 words

Number of Words Code

32000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP28,.6

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

5 V

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T28

资历状况

不合格

电源

5 V

温度等级

INDUSTRIAL

组织结构

32KX8

输出特性

3-STATE

内存宽度

8

待机电流-最大值

0.0005 A

记忆密度

262144 bit

I/O类型

COMMON

编程电压

12.5 V