STMicroelectronics XRAG2-SBN18I/1GE

表面安装

YES

Package Description

WAFER

Package Style

UNCASED CHIP

Package Body Material

UNSPECIFIED

Package Equivalence Code

DIE OR CHIP

Operating Temperature-Min

-20 °C

Operating Temperature-Max

55 °C

Manufacturer Part Number

XRAG2-SBN18I/1GE

Package Code

DIE

Package Shape

UNSPECIFIED

Manufacturer

STMicroelectronics

Part Life Cycle Code

Obsolete

Ihs Manufacturer

STMICROELECTRONICS

Risk Rank

5.84

Part Package Code

WAFER

HTS代码

8542.39.00.01

子类别

其他电信集成电路

端子位置

UPPER

终端形式

无铅

功能数量

1

Reach合规守则

compliant

JESD-30代码

X-XUUC-N

资历状况

不合格

温度等级

OTHER

通信IC类型

电信电路