Taiwan Semiconductor BAS21 RF

安装类型

表面贴装

表面安装

YES

二极管元件材料

SILICON

终端数量

3

ECCN (US)

EAR99

Maximum DC Reverse Voltage (V)

250

Peak Reverse Repetitive Voltage (V)

250

Maximum Continuous Forward Current (A)

0.2

Peak Non-Repetitive Surge Current (A)

1

Peak Forward Voltage (V)

1.25

Peak Reverse Current (uA)

0.1@200V

Maximum Power Dissipation (mW)

225

Peak Reverse Recovery Time (ns)

50

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Standard Package Name

SOT-23

Supplier Package

SOT-23

Military

无

Mounting

表面贴装

Package Height

0.95(Max)

Package Length

3.05(Max)

Package Width

1.4(Max)

PCB changed

3

Lead Shape

Gull-wing

Number of Elements per Chip

1

Dimensions

3 x 1.4 x 1.2mm

Package Type

SOT-23

Maximum Diode Capacitance

5pF

Maximum Operating Temperature

+150 °C

Minimum Operating Temperature

-55 °C

Maximum Forward Current

625mA

Package Description

ROHS COMPLIANT, PLASTIC PACKAGE-3

Package Style

小概要

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-55 °C

Reflow Temperature-Max (s)

30

Operating Temperature-Max

150 °C

Rohs Code

有

Manufacturer Part Number

BAS21RF

Power Dissipation (Max)

0.225 W

Package Shape

RECTANGULAR

Manufacturer

台湾半导体

Number of Elements

1

Part Life Cycle Code

活跃

Ihs Manufacturer

TAIWAN SEMICONDUCTOR CO LTD

Risk Rank

5.57

包装

卷带

JESD-609代码

e3

零件状态

活跃

ECCN 代码

EAR99

类型

小信号开关二极管

端子表面处理

Matte Tin (Sn) - with Nickel (Ni) barrier

HTS代码

8541.10.00.70

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

Reach合规守则

compliant

引脚数量

3

JESD-30代码

R-PDSO-G3

资历状况

不合格

配置

Single

二极管类型

接收电极

输出电流-最大值

0.2 A

Rep Pk反向电压-最大值

250 V

二极管配置

Single

反向恢复时间-最大值

0.05 µs

宽度

1.4mm

高度

1.2mm

长度

3mm

RoHS状态

符合RoHS标准