Taiwan Semiconductor BU607

表面安装

NO

终端数量

2

晶体管元件材料

SILICON

Manufacturer Part Number

BU607

Part Life Cycle Code

活跃

Ihs Manufacturer

NEW JERSEY SEMICONDUCTOR PRODUCTS INC

Package Description

FLANGE MOUNT, O-MBFM-P2

Risk Rank

5.75

Number of Elements

1

Operating Temperature-Max

150 °C

Package Body Material

METAL

Package Shape

ROUND

Package Style

FLANGE MOUNT

Transition Frequency-Nom (fT)

10 MHz

端子位置

BOTTOM

终端形式

PIN/PEG

Reach合规守则

unknown

JESD-30代码

O-MBFM-P2

配置

SINGLE

箱体转运

COLLECTOR

晶体管应用

SWITCHING

极性/通道类型

NPN

JEDEC-95代码

TO-3

集电极电流-最大值(IC)

7 A

集电极-发射器电压-最大值

150 V