Taiwan Semiconductor GBPC2501 T0

表面安装

NO

二极管元件材料

SILICON

终端数量

4

ECCN (US)

EAR99

HTS

8541.10.00.80

Bridge Type

单相

Peak Reverse Repetitive Voltage (V)

100

Peak Average Forward Current (A)

25

Peak RMS Reverse Voltage (V)

70

Peak Non-Repetitive Forward Surge Current (A)

300

Peak Forward Voltage (V)

[email protected]

Peak Reverse Current (uA)

5

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

AEC Qualified

无

Standard Package Name

Module

Supplier Package

GBPC型壳体

Military

无

Mounting

Screw

Package Height

11.23(Max)

Package Length

29(Max)

Package Width

29(Max)

PCB changed

4

Package Description

S-PUFM-D4

Package Style

FLANGE MOUNT

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-55 °C

Reflow Temperature-Max (s)

未说明

Operating Temperature-Max

150 °C

Rohs Code

有

Manufacturer Part Number

GBPC25-01T0

Package Shape

SQUARE

Manufacturer

台湾半导体

Number of Elements

4

Part Life Cycle Code

活跃

Ihs Manufacturer

TAIWAN SEMICONDUCTOR CO LTD

Risk Rank

5.57

JESD-609代码

e3

零件状态

活跃

ECCN 代码

EAR99

端子表面处理

Matte Tin (Sn)

附加功能

UL 认证

HTS代码

8541.10.00.80

端子位置

UPPER

终端形式

SOLDER LUG

峰值回流焊温度（摄氏度）

未说明

Reach合规守则

compliant

引脚数量

4

JESD-30代码

S-PUFM-D4

配置

Single

二极管类型

桥式整流二极管

输出电流-最大值

25 A

相位的数量

1

Rep Pk反向电压-最大值

100 V

最大非代表Pk前进电流

300 A

击穿电压-最小值

100 V

RoHS状态

是,有豁免