Taiwan Semiconductor HDBL105G C1

生命周期状态

Production (Last Updated: 2 years ago)

表面安装

NO

二极管元件材料

SILICON

终端数量

4

ECCN (US)

EAR99

Bridge Type

单相

Peak Reverse Repetitive Voltage (V)

600

Peak Average Forward Current (A)

1

Peak RMS Reverse Voltage (V)

420

Peak Non-Repetitive Forward Surge Current (A)

50

Peak Forward Voltage (V)

1.7

Peak Reverse Current (uA)

5

Peak Reverse Recovery Time (ns)

75

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Automotive

无

Supplier Package

DBL

Military

无

Mounting

通孔

Package Height

2.6(Max)

Package Length

8.51(Max)

Package Width

6.5(Max)

PCB changed

4

Manufacturer Lifecycle Status

ACTIVE (Last Updated: 2 years ago)

RoHS

Non-Compliant

Package Description

R-PDIP-T4

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-55 °C

Reflow Temperature-Max (s)

未说明

Operating Temperature-Max

150 °C

Rohs Code

有

Manufacturer Part Number

HDBL105GC1

Package Shape

RECTANGULAR

Manufacturer

台湾半导体

Number of Elements

4

Part Life Cycle Code

活跃

Ihs Manufacturer

TAIWAN SEMICONDUCTOR CO LTD

Risk Rank

5.72

包装

Tube

JESD-609代码

e3

零件状态

活跃

ECCN 代码

EAR99

端子表面处理

Matte Tin (Sn)

附加功能

UL 认证

端子位置

DUAL

终端形式

THROUGH-HOLE

峰值回流焊温度（摄氏度）

未说明

Reach合规守则

compliant

引脚数量

4

JESD-30代码

R-PDIP-T4

配置

Single

二极管类型

桥式整流二极管

输出电流-最大值

1 A

相位的数量

1

Rep Pk反向电压-最大值

600 V

最大非代表Pk前进电流

50 A

击穿电压-最小值

600 V

RoHS状态

是,有豁免