TDK B43580A5478M000

表面安装

NO

端子形状

BINDING POST

越来越多的功能

支架

介电材料

ALUMINUM (WET)

终端数量

2

Package

Box

Base Product Number

XCZU29

厂商

AMD

Product Status

活跃

For Use With/Related Products

XCZU29DR

Package Description

,

Operating Temperature-Min

-40 °C

Operating Temperature-Max

105 °C

Rohs Code

有

Manufacturer Part Number

B43580A5478M000

Package Shape

圆柱形封装

Manufacturer

TDK Epcos

Part Life Cycle Code

Obsolete

Ihs Manufacturer

EPCOS AG

Risk Rank

5.84

系列

Zynq® UltraScale+™

无铅代码

有

ECCN 代码

EAR99

类型

FPGA + MCU/MPU SoC

附加功能

STANDARD: IEC60384-4

电容量

4700 µF

包装方式

BULK

Reach合规守则

compliant

电容式

铝电解电容器

极性

POLARIZED

注意

P/N Breakdown: J = Japan version does not ship with a power supply

额定(DC)电压(URdc)

450 V

泄漏电流

8.03627 mA

纹波电流

14700 mA

正容差

20%

负公差

20%

等效串联电阻

40 mΩ

内容

Board(s), Cable(s), Accessories - Power Supply Not Included -

平台

Zynq UltraScale+ RFSoC ZCU1275 Japan

互连系统

FMC

建议的编程环境

Vivado