Teledyne e2v EVS32M16T-5 BI

HTS

8542.32.00.41

Module

DRAM模块

Module Density

1Gbit

Number of Chip per Module

2

Chip Density (bit)

512M

Data Bus Width (bit)

16

Maximum Clock Rate (MHz)

167

Chip Configuration

32Mx16

Chip Package Type

66TSOP-II

Minimum Operating Supply Voltage (V)

2.3

Typical Operating Supply Voltage (V)

2.5

Maximum Operating Supply Voltage (V)

2.7

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

ECC Support

无

Number of Chip Banks

4

CAS Latency

3

SPD EEPROM Support

无

Supplier Package

TSOP-II

Mounting

表面贴装

Package Height

1.8(Min)

Package Length

22.62(Max)

PCB changed

66

引脚数量

66

组织结构

64Mx16

锁相环

无

自我刷新

有

RoHS状态

供应商未确认