Texas Instruments DS90CF384SLC

表面安装

YES

终端数量

64

Package Description

0.80 MM PITCH, FBGA-64

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

DS90CF384SLC

Interface Standards

EIA-644; TIA-644

Package Code

LFBGA

Package Shape

SQUARE

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.54

Part Package Code

BGA

端子位置

BOTTOM

终端形式

BALL

功能数量

4

端子间距

0.8 mm

Reach合规守则

unknown

引脚数量

64

JESD-30代码

S-PBGA-B64

资历状况

COMMERCIAL

温度等级

INDUSTRIAL

座位高度-最大

1.5 mm

输入特性

DIFFERENTIAL

接口IC类型

LINE RECEIVER

接收器位数

4

宽度

8 mm

长度

8 mm