Texas Instruments F3850DM

表面安装

NO

终端数量

40

Package Description

DIP, DIP40,.6

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP40,.6

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

F3850DM

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Texas

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Microprocessors

技术

MOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T40

资历状况

不合格

电源

5,12 V

温度等级

MILITARY

速度

2 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

电源电流-最大值

105 mA

位元大小

8